Ukusetshenziswa komugqa weseli ongemuva we-SMT embonini ye-elekthronikhi ye-3C
IGREEN iyinhlangano Kazwelonke Yobuchwepheshe Bezobuchwepheshe ezinikele ku-R&D kanye nokukhiqiza ukuhlanganiswa kwemishini kagesi okuzenzakalelayo kanye nemishini yokupakisha ye-semiconductor kanye nemishini yokuhlola.
Ukusebenzela abaholi bezimboni abanjengo-BYD, Foxconn, TDK, SMIC, Canadian Solar, Midea, kanye namanye amabhizinisi angama-20+ weFortune Global 500. Uzakwethu omethembayo wezixazululo ezithuthukile zokukhiqiza.
I-Surface Mount Technology (SMT) iyinqubo ewumnyombo ekukhiqizeni izinto zikagesi zesimanje, ikakhulukazi embonini ye-3C (ikhompyutha, ukuxhumana, izinto zikagesi zabathengi). Ikhweza izingxenye ezingenamthofu/ezinomthofu omfushane (ama-SMD) ngokuqondile ezindaweni eziphakeme ze-PCB, ivumela ukukhiqizwa okuphezulu kokuminyana, okwenziwe okuncane, okungasindi, okuthembeke kakhulu, nokusebenza kahle kakhulu.Isetshenziswa kanjani imigqa ye-SMT embonini ye-elekthronikhi ye-3C, kanye nemishini ebalulekile kanye nezigaba zenqubo kumugqa weseli we-SMT ongemuva.
□ Imikhiqizo kagesi ye-3C (njengama-smartphones, amaphilisi, amakhompyutha aphathekayo, amawashi ahlakaniphile, ama-headphone, amarutha, njll.) idinga ukwenziwa kancane ngokwedlulele, amaphrofayili amancane, ukusebenza okuphezulu,futhi ngokushesha
Imigqa ye-iteration.SMT isebenza njengendawo yokukhiqiza emaphakathi ebhekana ngqo nalezi zimfuno.
□ Ukuthola I-Extreme Miniaturization kanye ne-Lightweighting:
I-SMT inika amandla ukuhlelwa okuminyene kwezingxenye ezincane (isb, 0201, 01005, noma ama-resistors/capacitor amancane; ama-fine-pitch BGA/CSP chips) kuma-PCB, kwehlisa kakhulu ibhodi lesekhethi
unyawo, ivolumu yedivayisi iyonke, nesisindo—isinikezeli esibalulekile samadivayisi aphathekayo njengama-smartphone.
□ Ukunika amandla I-High-Density Interconnect & Ukusebenza Okuphezulu:
Imikhiqizo yesimanje ye-3C idinga ukusebenza okuyinkimbinkimbi, edinga ama-PCB e-high-density interconnect (HDI) kanye nemizila eyinkimbinkimbi yezendlalelo eziningi. Amakhono okubekwa okunemba kwe-SMT akha i-
isisekelo sokuxhunywa okuthembekile kwezintambo ezixinene kakhulu nama-chips athuthukile (isb, amaphrosesa, amamojula wememori, amayunithi e-RF), okuqinisekisa ukusebenza kahle komkhiqizo.
□ Ukuthuthukisa Ukusebenza Kakuhle Kokukhiqiza Nokunciphisa Izindleko:
Imigqa ye-SMT iletha i-automation ephezulu (ukuphrinta, ukubekwa, ukugeleza kabusha, ukuhlolwa), ukuphuma okushesha kakhulu (isb., amanani okubekwa angaphezu kuka-100,000 CPH), kanye nokungenelela okwenziwa ngesandla okuncane. Lokhu
iqinisekisa ukungaguquguquki okukhethekile, amanani entengo aphezulu, futhi yehlisa ngokuphawulekayo izindleko zeyunithi ngayinye ekukhiqizeni ngobuningi—iqondaniswe ngokuphelele nezidingo zemikhiqizo ye-3C yokushesha ukuya emakethe futhi
amanani okuncintisana.
□ Ukuqinisekisa ukwethembeka nekhwalithi yomkhiqizo:
Izinqubo ezithuthukisiwe ze-SMT—okuhlanganisa ukuphrinta okunembayo, ukubekwa okunembayo okuphezulu, iphrofayela egeleza kabusha elawulwayo, nokuhlola okuqinile okungaphakathi komugqa—isiqinisekiso sokuvumelana kwe-solder kanye
ukwethembeka. Lokhu kunciphisa kakhulu iziphambeko ezinjengamajoyinti abandayo, amabhuloho, nokungaqondani kahle kwengxenye, ukuhlangabezana nezidingo eziqinile zokusebenza kwemikhiqizo ye-3C yemikhiqizo eqinile.
izindawo (isb., ukudlidliza, ukuhamba ngebhayisikili okushisayo).
□ Ukuzivumelanisa nokuphindaphinda komkhiqizo osheshayo:
Ukuhlanganiswa kwezimiso ze-Flexible Manufacturing System (FMS) kwenza imigqa ye-SMT ishintshe ngokushesha phakathi kwamamodeli womkhiqizo, iphendule ngamandla ekuguqukeni okusheshayo.
izidingo zemakethe ye-3C.
I-Laser Soldering
Inika amandla ukunemba okulawulwa kwezinga lokushisa ukuze kuvinjelwe ukulimala ezingxenyeni ze-thermosensitive. Isebenzisa ukucubungula okungathintana naye okuqeda ingcindezi yemishini, igwema ukususwa kwengxenye noma ukuguqulwa kwe-PCB—okulungiselelwe indawo egobile/engajwayelekile.
I-Wave Soldering ekhethiwe
Ama-PCB anabantu abaningi angena kuhhavini yokugeleza kabusha, lapho iphrofayili yokushisa elawulwa ngokunembile (ukushisa kuqala, ukucwiliswa emanzini, ukugeleza kabusha, ukupholisa) kuncibilikisa ukunamathisela kwe-solder. Lokhu kuvumela ukumanziswa kwamaphedi nemikhondo yengxenye, kwakha amabhondi ensimbi athembekile (amalunga e-solder), okulandelwa ukuqiniswa lapho kupholiswa. Ukuphathwa kwejika lokushisa kubaluleke kakhulu ngekhwalithi yokushisela nokuthembeka kwesikhathi eside.
Ukusabalalisa Okugcwele Okuzenzakalelayo Okusheshayo Okuphezulu Emgqeni
Ama-PCB anabantu abaningi angena kuhhavini yokugeleza kabusha, lapho iphrofayili yokushisa elawulwa ngokunembile (ukushisa kuqala, ukucwiliswa emanzini, ukugeleza kabusha, ukupholisa) kuncibilikisa ukunamathisela kwe-solder. Lokhu kuvumela ukumanziswa kwamaphedi nemikhondo yengxenye, kwakha amabhondi ensimbi athembekile (amalunga e-solder), okulandelwa ukuqiniswa lapho kupholiswa. Ukuphathwa kwejika lokushisa kubaluleke kakhulu ngekhwalithi yokushisela nokuthembeka kwesikhathi eside.
Umshini we-AOI
Ukuhlolwa kwe-Post-Reflow AOI:
Ngemva kokuthengiswa kabusha, amasistimu e-AOI (Automated Optical Inspection) asebenzisa amakhamera anokulungiswa okuphezulu kanye nesofthiwe yokucubungula izithombe ukuze ahlole ngokuzenzakalelayo ikhwalithi ehlangene ye-solder kuma-PCB.
Lokhu kuhlanganisa ukubona amaphutha afana nalawa:I-Solder Defects: I-solder enganele/eqile, amajoyinti abandayo, ibhuloho.Ukukhubazeka Kwengxenye: Ukungaqondani kahle, izingxenye ezingekho, izingxenye ezingalungile, i-polarity ehlehlisiwe, amatshe ethuneni .
Njengendawo yokulawula ikhwalithi ebalulekile emigqeni ye-SMT, i-AOI iqinisekisa ubuqotho bokukhiqiza.
Umshini Wokukrufutha Oqondiswe Emgqeni Oqondiswa Umbono
Ngaphakathi kwemigqa ye-SMT (Surface Mount Technology), lolu hlelo lusebenza njengempahla yangemuva kokuhlanganiswa, luvikela izingxenye ezinkulu noma izakhi zesakhiwo kuma-PCB—njengamasinki okushisa, izixhumi, abakaki bezindlu, njll. Ihlanganisa ukuphakela okuzenzakalelayo kanye nokulawula i-torque ngokunemba, kuyilapho ithola amaphutha okuhlanganisa nezikulufu ezigejiwe, izintambo ezinezintambo ezinemithende.
