I-Double Tin Ball Laser Soldering Machine LAB201
Ukucaciswa kweMechanism
Imodeli | I-LAB201 | |
Laser nemingcele | Amandla | 150W |
Ubude begagasi | 1064 | |
Imodi | Ama-lasers we-pulse fibre eqhubekayo | |
Imininingwane yebhola ye-solder | 0.15-0.25mm/0.3-0.76mm/0.9-2.0mm(Ongakukhetha) | |
Isistimu yokumisa ebonakalayo | I-CCD, ukulungiswa ± 5 um | |
Amaphikseli ekhamera | 5 million pixels | |
Imodi yokulawula | I-PLC+PC Control | |
Ukunemba kokuphindaphinda | Ububanzi 0.02 mm | |
Icubungula ububanzi | 200mm*150mm(Okwenziwe ngokwezifiso) | |
Amandla okusebenza | <2KW/H | |
Umthombo womoya | Umoya ocindezelwe>0.5 MPa nitrogen > 0.5 MPa | |
Ubukhulu bangaphandle(L*W*H) | 1000*1100*1650(mm) | |
Isisindo | 500KG |
Izici
I-1.Ijubane lokushisa liyashesha, futhi ukuma kunembile, okungaqedwa ngemizuzwana engu-0.2;
2.Amabhola e-solder akhishwa ku-nozzle ekhethekile futhi amboze ngokuqondile ama-pads.
3.Akukho ukushintshashintsha okwengeziwe noma amanye amathuluzi adingekayo, akukho ukungcola okukhiqizwayo, okwandisa isikhathi sokuphila sezinto zikagesi;
4.Isekela ubukhulu obuncane obungu-0.15mm kumabhola kathayela, le mishini yokushisela ibhola le-laser ihambisana nenkambiso yokuthuthukiswa kwemishini yokukhiqiza ehlanganisiwe nenembayo;
5.Izingxube ze-solder ezihlukene zingahlanganiswa ngokukhetha ubukhulu bebhola le-solder;
6.Izinga le-welding eliqinile kanye nezinga eliphezulu lesivuno;
7.Bambisana ne-CCD yokubeka uhlelo ukuze uhlangabezane nezidingo zokukhiqiza okukhulu emigqeni yomhlangano;
8.UPH ≥ 8000 amaphuzu, isivuno ≥ 99% (okuhlobene nempahla yomkhiqizo nokuvumelana).