Umshini wokukhiya irobhothi lokukhiya onama-eksisi ayisithupha oGreen Floor

Umshini wokukhiya werobhothi ohlanganyelwe we-Green Floor-mounted six-axis Isithombe esifakiwe

IGreen Intelligent iyibhizinisi likazwelonke lobuchwepheshe obuphezulu eligxile ekuhlanganiseni okuzenzakalelayo kanye nemishini ye-semiconductor.

I-Green Intelligent igxile emikhakheni emithathu emikhulu: i-electronics ye-3C, amandla amasha, nama-semiconductors. Ngesikhathi esifanayo, kwasungulwa izinkampani ezine: Green Semiconductor, Green New Energy, Green Robot, kanye Green Holdings.

Imikhiqizo eyinhloko: ukukhiya isikulufu okuzenzakalelayo, ukusabalalisa okuzenzakalelayo kwesivinini esikhulu, ukunamathisela okuzenzakalelayo, ukuhlolwa kwe-AOI, ukuhlolwa kwe-SPI, i-wave soldering ekhethiwe kanye nezinye izinto zokusebenza; imishini ye-semiconductor: umshini wokubopha (i-aluminium wire, i-copper wire).

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ipharamitha yedivayisi

Imodeli	I-GR-XFBKB556611KK-VIS
I-Stroke (XYZ)	500600100mm
Umthwalo we-Y-eksisi	10Kg
Isivinini sokunyakaza kwe-eksisi	0-1200mm/s
Umthamo wokugcina igram	999 amaqembu
I-Outer de men sion(LWH)	730970900mm
Setha indlela yokuhlanganisa	Ukuma okubonakalayo
Ukusebenza kahle kokuvala	Isikulufu esisodwa singaba ngu-0.9-1.2S
Isivuno sokukhiya	99.98%
Ukunikezwa kwamandla okusebenzayo	I-AC220V
Umthombo womoya osebenzayo	0.4-0.7MPa
p awu	Cishe 1KW
Isisindo esiphelele somshini	Cishe.80kg
Isisindo (KG)	80
Uhlobo Lokumaketha	Umkhiqizo Omusha wango-2024

Izici zedivayisi

1.Sekela ukutholwa kwe-alamu njengokukhiya ukuvuza, ukushelela kwamazinyo, ukuphakama kokuntanta, ukuthola imbobo ye-CCD, ukuma kwe-CCD, nokulungiswa kwendawo ye-CCD;
I-2.Isistimu ifakwe i-Panasonic PLC, isikrini sokuthinta i-intshi engu-7, ikhompyutha yezimboni, kanye nesibonisi sezimboni esingu-15.6-intshi.Nge-lens yekhamera ye-Hikvision 500W, umthombo wokukhanya kwendandatho;
Amaqembu angu-3.999 amafomula ahlukene angahlelwa ngesikhathi esifanayo, futhi izikulufi ezifika ku-500 zingakhiywa umkhiqizo owodwa;
4.Ihambisana nezikulufo zesayizi ze-M0.8-M4;
I-5.Z-eksisi ingafakwa inzwa yokususwa kwe-laser (isilinganiso sobude bokuntanta), inzwa yokutholwa kwe-downforce (uyazikhethela);.
I-6.I-batch kagesi ingahlonywa i-HIOS batch kagesi, i-Qili isivinini sikagesi kagesi, i-servo batch kagesi, i-batch kagesi ehlakaniphile, njll.(ozikhethela);
7.Sekela ukuskena kwekhodi okuzenzakalelayo ngekhamera, ukuskena ikhodi okuzenzakalelayo ngesithwebuli sekhodi, ukuskena ikhodi ngesandla, futhi idivayisi ingalayisha i-MES ngokwezidingo zamakhasimende, njenge-torque, inani lamajika, i-engeli, umdwebo wejika le-Torque, isimo sokukhiya, umbiko wokukhiqiza. ,umbiko wekhwalithi, njll.; 8.Sekela ama-algorithms wokubonwayo ahlukahlukene we-Mark eyodwa, i-Double Mark kanye nokuma kwembobo eyindilinga; 9.Sekela i-DXF ukuze ungenise izixhumanisi zembobo futhi uthuthukise ukusebenza kahle kwezinhlelo (ngokuzithandela).