I-High Precision Duplex Laser Solder Ball Welding Machine

Umshini we-laser soldering wuhlelo oluzenzakalelayo olunembayo olusebenzisa ubuchwepheshe be-laser ukujoyina izingxenye ze-elekthronikhi nge-solder. Ngokungafani nezindlela zendabuko zokunamathisela (ezifana nezinsimbi zokunamathisela noma i-wave soldering), iletha amandla e-laser agxilile ukushisisa i-solder ngokunembile, kuncishiswe ukucindezeleka okushisayo ezingxenyeni ezizungezile.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ipharamitha Yedivayisi

ithem	inani
Uhlobo	Umshini Wokugcwalisa
Isimo	Okusha
Izimboni Ezisebenzayo	imboni ye-fuse, imboni ye-semiconductor, imboni yezokuxhumana
Umbiko Wokuhlolwa Kwemishini	Kuhlinzekiwe
Uhlobo Lokumaketha	Umkhiqizo Ojwayelekile
Iwaranti yezingxenye eziyinhloko	Iminyaka engu-1.5
Izingxenye Eziyinhloko	I-PLC, Motor, Umkhumbi wokucindezela
Indawo ye-Showroom	Lutho
Le yindawo ka Origin	China
	I-Guangdong
I gama le-brand	OKULUHLAZA
Amandla kagesi	220V
Ubukhulu	100110165(cm)
Ukusetshenziswa	i-soldering wire
Iwaranti	Iminyaka emi-3
Amaphuzu Okuthengisa Abalulekile	Ukunemba okuphezulu
Isisindo (KG)	500KG
Imodeli	I-LAB201
Imininingwane yebhola ye-solder	0.15-0.25mm/0.3-0.76mm/0.9-2.0mm(Ongakukhetha)
Isistimu yokumisa ebonakalayo	I-CCD, Isixazululo ± 5um
Amaphikseli ekhamera	5 million pixels
Imodi yokulawula	I-PLC+PC Control
Ukunemba kokuphindaphinda komshini	±0.02mm
Icubungula ububanzi	200mm*150mm(Okungenziwa ngokwezifiso)
Sebenzisa amandla	<2KW/H
Umthombo womoya	Umoya ocindezelwe>0.5 MPa nitrogen>0.5MPa
I-Outer demension(LW*H)	100011001650(mm)

Izici zedivayisi

1. Inqubo yokushisisa namaconsi iyashesha futhi ingaqedwa phakathi kwama-0.2s;

2. Qedela ukuncibilika kwebhola le-solder ku-solder nozzle ngaphandle kokusaphaza;

3. akukho kuguquguquka, akukho ukungcola, ukukhulisa impilo yezinto zikagesi;

4. Ubuncane bobubanzi bebhola le-solder bungu-0.15mm, obuhambisana nokuthuthukiswa komkhuba wokuhlanganisa nokunemba;

5. Ukushisela amalunga ahlukene e-solder kungaqedwa ngokukhethwa kosayizi webhola le-solder;

6. Izinga lokushisela elizinzile kanye nezinga eliphezulu lesivuno;

7. Ukusebenzisana nohlelo lokumisa lwe-CCD ukuze kuhlangatshezwane nezidingo zokukhiqiza ngobuningi bomugqa;

8. UPH > 8000 amaphuzu, isivuno > 99% (okuhlukile ngokomkhiqizo ohlukile)

Inkambu yohlelo lokusebenza

Ikhamera/imojula ye-CCM, umunwe wegolide/i-FPC, intambo, idivayisi yokuxhumana, idivayisi yokubona, imboni ye-fuse, i-semiconductor industry solder

Ibanga Lohlelo

I-laser solder ball welding ibona isigaba esinembayo: I-PCB pad kanye nokuxhumana kwegolide ngomunwe, i-FPC ne-PCB welding, intambo yocingo kanye

PCB welding, ingxenye THT plug-in idivayisi soldering. Imikhiqizo enamaphinikhodi ohlangothini olulodwa futhi iphikisana nemikhiqizo enamaphinikhodi womabili

izinhlangothi, neminye imikhiqizo eminingi yokushisela ngokunemba.