inhloko_isibhengezo1 (9)

Imishini Yokushisela Okuluhlaza Okunembayo Okuphezulu Okuzenzakalelayo I-Duplex Laser Solder Ball Welding Machine

IGreen Intelligent iyibhizinisi likazwelonke lobuchwepheshe obuphezulu eligxile ekuhlanganiseni okuzenzakalelayo kanye nemishini ye-semiconductor.

I-Green Intelligent igxile emikhakheni emithathu emikhulu: i-electronics ye-3C, amandla amasha, nama-semiconductors. Ngesikhathi esifanayo, kwasungulwa izinkampani ezine: Green Semiconductor, Green New Energy, Green Robot, kanye Green Holdings.

Imikhiqizo eyinhloko: ukukhiya isikulufu okuzenzakalelayo, ukusabalalisa okuzenzakalelayo kwesivinini esikhulu, ukunamathisela okuzenzakalelayo, ukuhlolwa kwe-AOI, ukuhlolwa kwe-SPI, i-wave soldering ekhethiwe kanye nezinye izinto zokusebenza; imishini ye-semiconductor: umshini wokubopha (i-aluminium wire, i-copper wire).


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ipharamitha yedivayisi

ithem inani
Uhlobo Umshini Wokugcwalisa
Isimo Okusha
Izimboni Ezisebenzayo imboni ye-fuse, imboni ye-semiconductor, imboni yezokuxhumana
Umbiko Wokuhlolwa Kwemishini Kuhlinzekiwe
Uhlobo Lokumaketha Umkhiqizo Ojwayelekile
Iwaranti yezingxenye eziyinhloko Iminyaka engu-1.5
Izingxenye Eziyinhloko I-PLC, Motor, Umkhumbi wokucindezela
Indawo ye-Showroom Lutho
Le yindawo ka Origin China
  I-Guangdong
I gama le-brand OKULUHLAZA
Amandla kagesi 220V
Ubukhulu 100*110*165(cm)
Ukusetshenziswa i-soldering wire
Iwaranti Iminyaka emi-3
Amaphuzu Okuthengisa Abalulekile Ukunemba okuphezulu
Isisindo (KG) 500KG
Imodeli I-LAB201
Imininingwane yebhola ye-solder 0.15-0.25mm/0.3-0.76mm/0.9-2.0mm(Ongakukhetha)
Isistimu yokumisa ebonakalayo I-CCD, Isixazululo ± 5um
Amaphikseli ekhamera 5 million pixels
Imodi yokulawula I-PLC+PC Control
Ukunemba kokuphindaphinda komshini ±0.02mm
Icubungula ububanzi 200mm*150mm(Okungenziwa ngokwezifiso)
Sebenzisa amandla <2KW/H
Umthombo womoya Umoya ocindezelwe>0.5 MPa nitrogen>0.5MPa
I-Outer demension(LW*H) 1000*1100*1650(mm)

Izici zedivayisi

1. Inqubo yokushisisa namaconsi iyashesha futhi ingaqedwa phakathi kwama-0.2s;

2. Qedela ukuncibilika kwebhola le-solder ku-solder nozzle ngaphandle kokusaphaza;

3. akukho kuguquguquka, akukho ukungcola, ukukhulisa impilo yezinto zikagesi;

4. Ubuncane bobubanzi bebhola le-solder bungu-0.15mm, obuhambisana nokuthuthukiswa komkhuba wokuhlanganisa nokunemba;

5. Ukushisela amalunga ahlukene e-solder kungaqedwa ngokukhethwa kosayizi webhola le-solder;

6. Izinga lokushisela elizinzile kanye nezinga eliphezulu lesivuno;

7. Ukusebenzisana nohlelo lokumisa lwe-CCD ukuze kuhlangatshezwane nezidingo zokukhiqiza ngobuningi bomugqa;

8. UPH > 8000 amaphuzu, isivuno > 99% (okuhlukile ngokomkhiqizo ohlukile)

I-QWE (11)
I-QWE (12)

Inkambu yohlelo lokusebenza

Ikhamera/imojula ye-CCM, umunwe wegolide/i-FPC, intambo, idivayisi yokuxhumana, idivayisi yokubona, imboni ye-fuse, i-semiconductor industry solder

I-QWE (13)
I-QWE (14)
I-QWE (15)

Ibanga Lohlelo

I-laser solder ball welding ibona isigaba esinembayo: I-PCB pad kanye nokuxhumana kwegolide ngomunwe, i-FPC ne-PCB welding, intambo yocingo kanye

PCB welding, ingxenye THT plug-in idivayisi soldering. Imikhiqizo enamaphinikhodi ohlangothini olulodwa futhi iphikisana nemikhiqizo enamaphinikhodi womabili

izinhlangothi, neminye imikhiqizo eminingi yokushisela ngokunemba.

Ukupakisha Nokulethwa

I-QWE (16)
I-QWE (17)

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