inhloko_isibhengezo1 (9)

Imishini Yokuhwebelana Kakhulu Eluhlaza Okuzenzakalelayo Yeziteshi Ezintathu Eziku-inthanethi

IGreen Intelligent iyibhizinisi likazwelonke lobuchwepheshe obuphezulu eligxile ekuhlanganiseni okuzenzakalelayo kanye nemishini ye-semiconductor.

I-Green Intelligent igxile emikhakheni emithathu emikhulu: i-electronics ye-3C, amandla amasha, nama-semiconductors. Ngesikhathi esifanayo, kwasungulwa izinkampani ezine: Green Semiconductor, Green New Energy, Green Robot, kanye Green Holdings.

Imikhiqizo eyinhloko: ukukhiya isikulufu okuzenzakalelayo, ukusabalalisa okuzenzakalelayo kwesivinini esikhulu, ukunamathisela okuzenzakalelayo, ukuhlolwa kwe-AOI, ukuhlolwa kwe-SPI, i-wave soldering ekhethiwe kanye nezinye izinto zokusebenza; imishini ye-semiconductor: umshini wokubopha (i-aluminium wire, i-copper wire).


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ipharamitha yedivayisi

Imodeli

GR-OH05

Amaphuzu Okuthengisa Abalulekile

Okuzenzakalelayo

Isisindo (KG)

1200 KG

Uhlobo

Umshini Wokugcwalisa

I gama le-brand

Okuhlaza

Umjikelezo Wemisebenzi Elinganiselwe

24 Ihora Ngokuqhubekayo

Amandla alinganiselwe

Inketho

Amandla kagesi

220V

Okwamanje

50HZ

Ubukhulu

L1700mm*W900mm*H1835mm

Sebenzisa

PCB

I-solder stroke

100*200*100(iyunithi: mm)

Isivinini sokunyakaza

I-XY eksisi (0~ 800mm,s) i-eksisi engu-Z (0~300mm,s)

Rukukwazi ukudla

±0.02 mm

umthwalo

0.4~0.7MPa

Amandla ohlelo

Ukulayisha umugqa 10KG

Isilawuli sezinga lokushisa

150W,200W,400W ngokuzithandela

Izinga lokushisa

0 ~ 450℃

Ibanga lokushisa le-alamu

Ibanga lokushisa le-alamu

Isikhathi sokushisa

0~9.9s

Izici zedivayisi

1.Izindlela zokuhlanganisa eziguquguqukayo, ngokushisela indawo, ukudonsa ukushisela (ukudonsa ukushisela) neminye imisebenzi

I-2.Idivayisi ingagcina amafayela okucubungula angu-150, amaphuzu wokuhlela we-1500 iqembu ngalinye

3.I-Solder jitter function, ukuvula lo msebenzi lapho ukushisela kungenza ukushisela kusheshe, kusebenza kahle kakhulu kumalunga amakhulu e-solder

4. Ithrekhi ehlangene ye-solder iyabonakala, ukuze opharetha akwazi ukuqonda inqubekelaphambili ye-solder futhi abasebenzi bonjiniyela bangakwazi ukuyisusa kalula.

5. Uhlelo lokusebenza lokubhala idivayisi lungakopishwa ukusuka kwelinye iphuzu ukuya kwelinye futhi vimba ukuze uvimbele, unciphise isikhathi sokubhala uhlelo futhi kulula ukufunda

6. Imishini inomsebenzi wokuhlanza othomathikhi, oqinisekisa ngempumelelo ikhwalithi yokucubungula i-solder nokwandisa impilo yesevisi yethiphu ye-solder iron

7. Ukunemba okunembayo kwe-motor drive kanye ne-algorithm ethuthukisiwe yokulawula ukunyakaza kwamukelwa ukuze kuthuthukiswe ngempumelelo ukunemba kokuma kokunyakaza kanye nokunemba kokuphindaphinda.

8. Umsebenzi oshintshashintshayo wesiteshi esiphindwe kabili, uhlangothi olulodwa wumsebenzi wokushisela, olunye uhlangothi lungabekwa imikhiqizo, luthuthukise ngempumelelo ukukhiqiza

Isiqephu esingu-14

Ibanga Lohlelo

Ifoni ephathekayo, ikhompuyutha, isifunda esihlanganisiwe, ithebhulethi, imboni yezimoto zedijithali, ukuhlanganiswa kwebhethri, isipikha, ibhodi le-PCB, umhlangano we-semiconductor microelectronics, i-solder module yekhamera.

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图片1
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Ukupakisha Nokulethwa

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