I-Solder Paste Dispenser kanye ne-Laser Soldering Machine GR-FJ03
Ukucaciswa kweMechanism
| Imodeli | GR-FJ03 |
| Imodi yokusebenza | Okuzenzakalelayo |
| Indlela yokondla | Ukondla ngezandla |
| Indlela yokusika | Ukusika ngesandla |
| Ukushaywa kwezisetshenziswa | (X1/X2) 250*(Y1/Y2) 300*(Z1/Z2)100(mm) |
| Isivinini sokunyakaza | 500mm/s (ubukhulu 800mm/s |
| Uhlobo lwezimoto | I-Servo motor |
| Ukuphindaphinda | ±0.02 mm |
| Izinto zokugcwalisa | I-solder inamathisela |
| Isistimu yokulawula yokunamathisela ye-dot solder | Ikhadi lokulawula ukunyakaza+umhleli ophathwa ngesandla |
| Uhlelo lwe-laser welding | Ikhompyutha yezimboni + ikhibhodi negundane |
| Uhlobo lwe-laser | I-laser ye-semiconductor |
| Laser wavelength | 915nm |
| Amandla we-laser aphezulu | 100W |
| Uhlobo lwe-laser | I-laser eqhubekayo |
| I-Fiber Core Diameter | 200/220um |
| i-soldering real-time monitoring | Ukuqapha ikhamera ye-coaxial |
| Indlela yokupholisa | Ukupholisa umoya |
| Umhlahlandlela | I-brand yaseTaiwan |
| Isikulufu induku | I-brand yaseTaiwan |
| Amaswishi kagesi wesithombe | Umkhiqizo we-Omron/Taiwan |
| Indlela yokubonisa | Gada |
| Indlela yokuphakela ithini | Ongakukhetha |
| Imodi yeDrayivu | I-Servo motor+ ukunemba isikulufu+umhlahlandlela wokunemba |
| Amandla | 3KW |
| Ukunikezwa kwamandla kagesi | I-AC220V/50HZ |
| Ubukhulu | 1350*890*1720MM |
Izici
1.Le mishini ye-laser iwumshini wama-eksisi ayisithupha - imishini emibili ihlanganiswa ihlombe nehlombe njengomshini owodwa, ifinyelela umsebenzi wokukhipha unamathisele we-solder ohlangothini olulodwa kanye ne-laser soldering ngakolunye uhlangothi;
I-2.I-othomathikhi ye-solder paste yokukhipha uhlelo ilawula ukunamathisela kwe-solder okukhiphayo ngesilawuli sokukhipha i-Musashi ngokunemba, esingalawula ngokunembile inani lethini elinikeziwe;
I-3.I-laser solder paste solder system ifakwe umsebenzi wempendulo yokushisa, engalawuli nje kuphela izinga lokushisa le-solder, kodwa futhi iqapha izinga lokushisa kwendawo ye-solder;
I-4.Isistimu yokuqapha ebonakalayo isebenzisa izithombe ukuze ibone ngokuzenzakalelayo isimo sokudayiswa komkhiqizo;
I-5.Laser solder paste soldering iwuhlobo lwe-solder engathinteki, engakhiqizi ukucindezeleka noma ugesi omile njenge-iron contact soldering. Ngakho-ke, umphumela we-laser soldering uthuthukiswa kakhulu uma kuqhathaniswa ne-iron soldering yendabuko;
I-6.Laser solder paste soldering ishisa endaweni kuphela amaphedi ahlangene e-solder, futhi inomthelela omncane wokushisa ebhodini le-solder kanye nomzimba wengxenye;
I-7.Inhlanganisela ye-solder ishisa ngokushesha ekushiseni okumisiwe, futhi ngemva kokushisa kwendawo, isivinini sokupholisa sokuhlanganiswa kwe-solder siyashesha, sakha isendlalelo se-alloy ngokushesha;
I-8.Ijubane lempendulo yezinga lokushisa elisheshayo: ikwazi ukulawula ngokunembile izinga lokushisa ukuze lihlangabezane nezidingo ezihlukahlukene ze-solder;
9.Ukunemba kokucubungula kwe-laser kuphakeme, indawo ye-laser incane(ububanzi bendawo bungakwazi ukulawulwa phakathi kuka-0.2-5mm), uhlelo lungalawula isikhathi sokucubungula, futhi ukunemba kuphakeme kunendlela yenqubo yendabuko. Ifanele ukuthelwa kwezingxenye ezincane zokunemba kanye nezindawo lapho izingxenye ze-solder zizwela kakhulu izinga lokushisa
10.I-laser beam encane ingena esikhundleni sethiphu yensimbi ehlanganisiwe, futhi kulula ukuyicubungula uma kukhona ezinye izinto eziphazamisayo ebusweni bengxenye ecutshunguliwe.
