inhloko_isibhengezo1 (9)

Imikhiqizo

  • Imishini yezimboni GR-FS4221-H umshini odidiyelwe wokusabalalisa weziteshi ezimbili

    Imishini yezimboni GR-FS4221-H umshini odidiyelwe wokusabalalisa weziteshi ezimbili

    Isingeniso somkhiqizo:

    I-GR-FS4221-M umshini odidiyelwe wokusaphaza weziteshi ezimbili unokusebenza kwezindleko eziphezulu, isistimu yokumisa okubukwayo ongayikhetha, isilinganiso sobude be-laser, ukutholwa kwezinga le-liquid, inaliti ezenzakalelayo, ukuhlanzwa kwezinaliti namanye amamojula omsebenzi asizayo ukuze kufezwe ukusebenza ngendlela oyifisayo, ukuhlangabezana neningi ukukhiqiza imisebenzi. Umshini ungahlonywa i-valve yomjovo we-piezoelectric engathinteki ukuze uthuthukise ukunemba, ukuphepha, lula, ukwethembeka kanye nokusebenza kahle kokukhiqiza kokukhipha. Ivamise ukusetshenziswa emisebenzini yokusabalalisa enembayo ephezulu njengamalensi omakhalekhukhwini namahedfoni.

  • Umshini ohlaza ozenzakalelayo we-Double-station all-in-one glue dispensing machine GR-FS4221-M

    Umshini ohlaza ozenzakalelayo we-Double-station all-in-one glue dispensing machine GR-FS4221-M

    Isingeniso somkhiqizo:

    I-GR-FS4221-M umshini odidiyelwe wokusaphaza odidiyelwe weziteshi ezimbili unokusebenza kwezindleko eziphezulu, isistimu yokumisa okubukwayo ongayikhetha, isilinganiso sobude be-laser, ukutholwa kwezinga le-liquid, inaliti ezenzakalelayo, ukuhlanzwa kwezinaliti namanye amamojula omsebenzi asizayo ukuze kuzuzwe ukwenziwa ngokwezifiso komsebenzi, ukuhlangabezana nemisebenzi eminingi yokukhipha. Umshini ungahlonywa i-valve yomjovo we-piezoelectric engathinteki ukuze uthuthukise ukunemba, ukuphepha, lula, ukwethembeka kanye nokusebenza kahle kokukhiqiza kokukhipha. Ivamise ukusetshenziswa emisebenzini yokusabalalisa enembayo ephezulu njengamalensi omakhalekhukhwini namahedfoni.

  • Imishini Yokukulungela Yedeskithophu Eluhlaza Ene-eksisi Emine ye-Adsorption Visual Lock Screw

    Imishini Yokukulungela Yedeskithophu Eluhlaza Ene-eksisi Emine ye-Adsorption Visual Lock Screw

    Izisetshenziswa zamukela idizayini yesakhiwo sokubukeka kwensimbi enama-eksisi amane, ukumodela ukubukeka kusebenzisa isitayela se-grun design element, ukuphakamisa umnyango we-clamshell, ikhibhodi yohlobo lwekhabethe elilula nokusebenza kwegundane. Umshini uzinzile futhi unokuphindaphinda okuphezulu. Ifakwe inqwaba kagesi ehlakaniphile, i-double station alternating operation. Kusetshenziswa isixhumi esibonakalayo se-PLC+ sokubeka esibonakalayo somshini ozithuthukisayo wokulawula izimboni kanye nekhibhodi negundane ukusiza abasebenzi ukuthi baxhumane. Yonga abasebenzi, kulula ukuyisebenzisa, kulula ukuyisebenzisa. Umshini ungasebenza amahora angama-24 ngaphandle kokuma isikhathi eside, ukukhiqizwa okuphezulu okusebenzayo.

  • Ivavu Yomjovo Ye-Piezo Ehlaza—GR-P101

    Ivavu Yomjovo Ye-Piezo Ehlaza—GR-P101

    I-P101 series piezoelectric injection valve iwuhlelo olunembayo lomjovo ongathinteki lwemidiya ephansi, emaphakathi kanye nephezulu ye-viscosity. Ngokwezici zemidiya ezihlukene, lolu chungechunge lwamamodeli lunohlobo lwe-hot melt, uhlobo lwe-anaerobic, uhlobo lwe-UV, uhlobo lokumelana nokugqwala okungakhethwa kukho.

  • Umshini ohlaza wokubona phansi oluhlaza GR-FD10

    Umshini ohlaza wokubona phansi oluhlaza GR-FD10

    Omakhalekhukhwini, amakhompuyutha, amasekhethi ahlanganisiwe, amaphilisi, ukusatshalaliswa kwesipikha sokuhlanganisa ibhethri lemboni yezimoto yedijithali
    Izingxenye eziwumshini ezivala uphondo lwezingxenyekazi zehadiwe izesekeli ze-chip ezibopha i-semiconductor ukupakishwa kwe-LED okunamathiselwe kokuhlobisa kwebhodi le-PCB
    isabalalisa imojula yekhamera yokuhlanganisa ye-semiconductor microelectronics (ukulungiswa kwelensi, ukukhishwa kwe-VCM, njll.)

  • I-Green GR-FD15 Dispenser Industrial Floor Type Double Y Hot Melt Spray Glue Machine

    I-Green GR-FD15 Dispenser Industrial Floor Type Double Y Hot Melt Spray Glue Machine

    Omakhalekhukhwini, amakhompyutha, amasekhethi ahlanganisiwe, amaphilisi, idijithali, isipikha sokuhlanganisa ibhethri lezimboni ezikhipha izingxenye zemishini ezivala Izingxenyekazi zezingxenyekazi ze-Hardware chip ebopha i-semiconductor ukupakishwa kwe-LED enamathelayo yokuhlobisa ibhodi ye-PCB yokukhipha.

  • Imishini yokukhipha ama-GR-Au350-LM Umshini wokuphakelayo ozenzakalelayo wejubane eliphezulu ku-inthanethi

    Imishini yokukhipha ama-GR-Au350-LM Umshini wokuphakelayo ozenzakalelayo wejubane eliphezulu ku-inthanethi

    Uchungechunge lwe-Au350 lwemishini yokukhipha impahla ye-inthanethi enesivinini esikhulu lungasetshenziswa ukuphatha uhla olubanzi lokusatshalaliswa kanye nezicelo zokuhlola ze-AOI.

    Uchungechunge oluphezulu lwe-Au350 umshini wokuphakela ngesivinini esiphezulu ku-inthanethi ugxile kuyo yonke imininingwane lapho umshini wonke uklanywa, uhlanganiswe nezimo ezihlukahlukene zokusatshalaliswa kwempahla kanye nezidingo zenqubo okuhlangatshezwane nazo efekthri esikhathini esidlule, futhi uthuthukiswa ngokuqhubekayo ngezizukulwane zayo zemikhiqizo Ngokuqamba emisha, ihlanganisa ubuchwepheshe obuhlukahlukene bokusabalalisa futhi inikeza izixazululo ezihlukahlukene ezizenzakalelayo ezizenzakalelayo zokusabalalisa eziku-inthanethi.Isetshenziswa kakhulu ezintweni zikagesi zabathengi, ugesi wezimoto, ama-semiconductors, i-PCB, i-FPCC, i-IC yokupakisha nezinye izimboni.

  • Ivavu Yomjovo Ye-Piezo Ehlaza—GE100

    Ivavu Yomjovo Ye-Piezo Ehlaza—GE100

    Isebenza ochungechungeni lwe-Adhesive: I-Adhesive ye-UV, i-primer, i-epoxy resin, i-acrylic acid, i-polyurethane, i-adhesive abicah, i-silver paste, i-solder paste, igrisi, uyinki, uketshezi lwe-biomedical, kanye nokudlulisa umthamo wegesi. Ibanga lesifutho lingaphakathi kuka-20000 CPS we-viscosity yoketshezi, futhi okunye uketshezi olune-viscosity engu-100000 CPS lungafuthwa.

  • I-Semiconductor IC Bonding Equipment/Aluminium Wedge Bonding Machine GR-W01

    I-Semiconductor IC Bonding Equipment/Aluminium Wedge Bonding Machine GR-W01

    Amabhethri wamandla amasha, ama-photovoltaic inverters, ugesi wezimoto, ukugcinwa kwamandla, i-IGBT, amabhodi okulawula ukuphepha kwebhethri e-BMS, njll;

    Lo mshini wokuhlanganisa izintambo ungahambisana ne-aluminium ne-copper wire bonding;

  • Umshini We-Aluminium Wokubopha Intambo Ochungechungeni Lokuhlanganisa Izintambo -I-Wedge Bonding ICs/GR-W02

    Umshini We-Aluminium Wokubopha Intambo Ochungechungeni Lokuhlanganisa Izintambo -I-Wedge Bonding ICs/GR-W02

    I-Single-row TO uchungechunge olukhethekile lomshini wokuhlanganisa ucingo;

    I-GR-W02 ingumshini wokubopha ngocingo ofaneleka kumadivayisi kagesi, umkhiqizo uhambisana nomugqa owodwa kuya kokupakishwa nokuklanywa kwe-ultrasonic yemigqa eminingi, i-bonder isetshenziswa ngemva kwenani elikhulu lokuthuthukiswa okuphindaphindiwe, kusetshenziswa ama-motor linear azinzile futhi anokwethenjelwa, ikhoyili yezwi. ama-motor, izinhlelo ze-ultrasonic zokukhiqiza. Ngaphezu kwalokho, ikhono elinwetshiwe lokuqaphela iphethini ledivayisi lihlinzeka ngokukhiqiza nokuthembeka okuhamba phambili embonini.

  • I-Green Automatic Soldering Robot Tip—911G Series

    I-Green Automatic Soldering Robot Tip—911G Series

    Amathiphu we-robotic solder we-solder robot. Amathiphu ochungechunge lwe-911G, isevisi ye-solder eyenziwe ngezifiso iyatholakala.

  • Ulayini Womshini Wokufafaza onomsebenzi wokuphenyisisa ozenzakalelayo AL-DPC01

    Ulayini Womshini Wokufafaza onomsebenzi wokuphenyisisa ozenzakalelayo AL-DPC01

    Umshini wokukhipha impahla wohlobo lwaphansi onesidluliseli esingaphakathi komugqa ukuze uthuthe umkhiqizo usuka esiteshini sokugcina uye esiteshini esilandelayo, futhi uqedele inqubo yokukhipha ngokuphenya ngokuzenzakalelayo. Ukulungiswa komkhiqizo kuzothunyelwa futhi kubuyiswe ulayini wokuthutha osemaceleni amabili. Kudingeka isisebenzi esingu-1 kuphela ekukhiqizeni.