I-Semiconductor IC Bonding Equipment/Aluminium Wedge Bonding Machine GR-W01

Amabhethri wamandla amasha, ama-photovoltaic inverters, ugesi wezimoto, ukugcinwa kwamandla, i-IGBT, amabhodi okulawula ukuphepha kwebhethri e-BMS, njll;

Lo mshini wokuhlanganisa izintambo ungahambisana ne-aluminium ne-copper wire bonding;

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Isici soMkhiqizo

● Hlanganisa izintambo eziwugqinsi namapheshana endaweni yesikhulumi somshini owodwa ngokushintshwa kwesistimu okusheshayo;
● Ngokulawula inqubo yokushisela enelungelo lobunikazi, imingcele yokushisela ingalungiswa ngesikhathi sangempela ukuze kuqinisekiswe ikhwalithi yokushisela ephindaphindwayo;
●Inqubo yokwenza izinto obala ngokuhlanganiswa okungenamthungo ngokwemigomo ye-Industrial 4.0/OT;
● Zuza okuhamba phambili kokumataniswa kwempahla ngokusebenzisa izinhlobonhlobo zamafrikhwensi e-ultrasonic ongakhetha kuzo, futhi ukhuthaze ukuzinza kwenqubo;
● Ukuhlanganiswa kobuchwepheshe benqubo kanye ne-automation kusuka emthonjeni owodwa wokuhlinzeka.