Umshini Wokubopha Ngocingo
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I-Semiconductor IC Bonding Equipment/Aluminium Wedge Bonding Machine GR-W01
Amabhethri wamandla amasha, ama-photovoltaic inverters, ugesi wezimoto, ukugcinwa kwamandla, i-IGBT, amabhodi okulawula ukuphepha kwebhethri e-BMS, njll;
Lo mshini wokuhlanganisa izintambo ungahambisana ne-aluminium ne-copper wire bonding;
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Umshini We-Aluminium Wokuhlanganisa Izintambo Zoku-TO Uchungechunge Lwezintambo Zokubopha -I-Wedge Bonding ICs/GR-W02
I-Single-row TO uchungechunge olukhethekile lomshini wokuhlanganisa ucingo;
I-GR-W02 ingumshini wokubopha ucingo ofaneleka kumadivayisi kagesi, umkhiqizo uhambisana nomugqa owodwa kuya ku-multi-row ukupakisha nokuklama kwe-ultrasonic, i-bonder isetshenziswa ngemva kwenani elikhulu lokuthuthukiswa okuphindaphindiwe, kusetshenziswa ama-motor linear azinzile futhi anokwethenjelwa, ama-coil motors wezwi, izinhlelo ze-ultrasonic zokukhiqiza. Ngaphezu kwalokho, ikhono elinwetshiwe lokuqaphela iphethini ledivayisi lihlinzeka ngokukhiqiza nokuthembeka okuhamba phambili embonini.
